Invention Application
- Patent Title: Bundle Bill/Check Acceptor
- Patent Title (中): 捆绑比尔/检查接受者
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Application No.: US13554094Application Date: 2012-07-20
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Publication No.: US20130020172A1Publication Date: 2013-01-24
- Inventor: Jin Hwan Cha , Kyung Joo Shin , Woo Ho Lee , Ho Keun Lee , Hyun Soo Jang
- Applicant: Jin Hwan Cha , Kyung Joo Shin , Woo Ho Lee , Ho Keun Lee , Hyun Soo Jang
- Applicant Address: KR Seoul
- Assignee: NAUTILUS HYOSUNG INC.
- Current Assignee: NAUTILUS HYOSUNG INC.
- Current Assignee Address: KR Seoul
- Priority: KR10-2011-0072337 20110721
- Main IPC: G07F7/04
- IPC: G07F7/04 ; G07D7/20

Abstract:
A bundle bill/check acceptor includes a bundle receiving module to receive a bundle of bills/checks. The bundle of bills/checks is separated on a leaf-by-leaf basis by a transfer module. The accepter further includes an alignment module to align the individual bill/check, an escrow module to escrow a plurality of bills/checks, and a reject module to discharge a rejected bill/check or a bill/check escrowed by the escrow module requested to cancel the deposit thereof to the bundle receiving module. A normal bill and check are separately received in a cassette unit.
Public/Granted literature
- US08695776B2 Bundle bill/check acceptor Public/Granted day:2014-04-15
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