A system for cutting, inking, and debossing sheet material located between a die and a cutting plate is provided. The system includes a die having a support defining an opening, a blade positioned adjacent to the support and defining a cutting edge, a debossing plate configured to cause one or more indentations in the sheet material and including a first side and a second side located substantially opposite the first side, the first side having a raised pattern defined thereon, and at least one pin configured to extend through the opening in the support and to move between a first position and a second position. When the at least one pin is in the first position, the debossing plate is supported by the support, and when the at least one pin is in the second position, the debossing plate is supported by the at least one pin.