发明申请
- 专利标题： LEAD COMPONENT HOLDER AND ELECTRONIC DEVICE
- 专利标题（中）： 铅组件架和电子设备
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申请号： US13494022申请日： 2012-06-12
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公开(公告)号： US20130025924A1公开(公告)日： 2013-01-31
- 发明人: Kenta SASAHARA , Junya Mizumoto , Masafumi Sakai
- 申请人： Kenta SASAHARA , Junya Mizumoto , Masafumi Sakai
- 申请人地址： JP Kitakyushu-shi
- 专利权人： KABUSHIKI KAISHA YASKAWA DENKI
- 当前专利权人： KABUSHIKI KAISHA YASKAWA DENKI
- 当前专利权人地址： JP Kitakyushu-shi
- 优先权： JP2011-163329 20110726
- 主分类号： H05K1/18
- IPC分类号： H05K1/18
摘要：
A lead component holder includes a plurality of supporting portions each supporting a lead component at a position distant from a component mounting surface of a substrate, and at least one coupling member coupling the adjacent supporting portions at a position distant from the component mounting surface. An electronic device includes the substrate, the lead component holder, and an electronic component mounted to the substrate located below the coupling member.
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