发明申请
- 专利标题： Method For Manufacturing Wraparound Shield Write Head Using Hard Masks
- 专利标题（中）： 使用硬掩模制造绕组屏蔽写头的方法
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申请号： US13193520申请日： 2011-07-28
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公开(公告)号： US20130026131A1公开(公告)日： 2013-01-31
- 发明人: Shiwen Huang , Fenglin Liu , Qiping Zhong , Kyusik Shin , Yingjian Chen
- 申请人： Shiwen Huang , Fenglin Liu , Qiping Zhong , Kyusik Shin , Yingjian Chen
- 申请人地址： US CA San Jose
- 专利权人： Hitachi Global Storage Technologies Netherlands B.V.
- 当前专利权人： Hitachi Global Storage Technologies Netherlands B.V.
- 当前专利权人地址： US CA San Jose
- 主分类号： G11B5/127
- IPC分类号： G11B5/127
摘要：
The present disclosure describes a method for manufacturing a full wraparound shield damascene write head through the implementation of a three layered (tri-layered) hard mask. According to an embodiment of the invention, the various layers of hard mask are used for different purposes during the formation of a write head. The wraparound shield head of the present invention exhibits improved physical characteristics that further result in improved performance characteristics. Use of the hard mask layers according to the present invention allows for use of manufacturing processes that can be more closely controlled than those processes used in other processes. For example, smaller dimension lithographic techniques can be used. Also, reliance on certain CMP processes is not necessary where the use of CMP processes is not as well-controlled as deposition or lithographic techniques as is possible using the present invention.