Invention Application
- Patent Title: INTEGRATED CIRCUIT CHIP WITH REDUCED IR DROP
- Patent Title (中): 集成电路芯片，减少红外线
-
Application No.: US13205648Application Date: 2011-08-09
-
Publication No.: US20130037934A1Publication Date: 2013-02-14
- Inventor: Chih-Ching Lin , Ya-Ting Chang , Chia-Lin Chuang
- Applicant: Chih-Ching Lin , Ya-Ting Chang , Chia-Lin Chuang
- Main IPC: H01L23/48
- IPC: H01L23/48
Abstract:
An integrated circuit chip includes a power/ground interconnection network in a topmost metal layer over a semiconductor substrate and at least a bump pad on/over the power/ground interconnection network. The power/ground mesh interconnection network includes a first power/ground line connected to the bump pad and extending along a first direction, and a connection portion connected to the bump pad and extending along a second direction.
Public/Granted literature
- US08772928B2 Integrated circuit chip with reduced IR drop Public/Granted day:2014-07-08
Information query
IPC分类:
