- 专利标题： SEMICONDUCTOR CHIPS HAVING A DUAL-LAYERED STRUCTURE, PACKAGES HAVING THE SAME, AND METHODS OF FABRICATING THE SEMICONDUCTOR CHIPS AND THE PACKAGES
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申请号： US13564431申请日： 2012-08-01
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公开(公告)号： US20130037942A1公开(公告)日： 2013-02-14
- 发明人: In Chul HWANG , Jae Myun KIM , Seung Jee KIM , Jin Su LEE
- 申请人： In Chul HWANG , Jae Myun KIM , Seung Jee KIM , Jin Su LEE
- 申请人地址： KR Icheon-si
- 专利权人： SK HYNIX INC.
- 当前专利权人： SK HYNIX INC.
- 当前专利权人地址： KR Icheon-si
- 优先权： KR10-2011-0078757 20110808
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/48 ; H01L21/50
摘要：
Dual-layered structural semiconductor chips are provided. The semiconductor chip includes a first semiconductor chip and a second semiconductor chip bonded to the first semiconductor chip. The first semiconductor chip includes a first substrate having a first bottom surface. The second semiconductor chip includes a second substrate having a second bottom surface. The first bottom surface directly contacts the second bottom surface. The related packages and the related methods are also provided.
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