发明申请
- 专利标题： ADHESIVE COMPOSITION FOR SEMICONDUCTORS, ADHESIVE FILM PREPARED USING THE SAME, AND SEMICONDUCTOR DEVICE INCLUDING THE FILM
- 专利标题（中）： 用于半导体的粘合组合物，使用其的粘合膜和包括膜的半导体器件
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申请号： US13571574申请日： 2012-08-10
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公开(公告)号： US20130041088A1公开(公告)日： 2013-02-14
- 发明人: Baek Soung PARK , Ki Tae SONG , In Hwan KIM
- 申请人： Baek Soung PARK , Ki Tae SONG , In Hwan KIM
- 优先权： KR10-2011-0080169 20110811
- 主分类号： C09J163/00
- IPC分类号： C09J163/00
摘要：
An adhesive composition for semiconductors, an adhesive film prepared using the adhesive composition, and a semiconductor device including the adhesive film, the adhesive composition exhibiting two exothermic peaks at temperatures ranging from 65° C. to 350° C., wherein a first exothermic peak appears at a lower temperature than a second exothermic peak, and the adhesive composition has a curing rate of about 70% to 100% in a first exothermic peak zone, as calculated by Equation 1: Curing rate=[(Heating value upon 0 cycle−Heating value after 1 cycle)/Heating value upon 0 cycle]×100.