发明申请
- 专利标题： Laser Assisted Nail Avulsion
- 专利标题（中）： 激光辅助指甲撕裂
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申请号： US13560343申请日： 2012-07-27
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公开(公告)号： US20130041308A1公开(公告)日： 2013-02-14
- 发明人: David R. Hennings , Elwood Phillips , Randolph W. Nordyke
- 申请人： David R. Hennings , Elwood Phillips , Randolph W. Nordyke
- 主分类号： A61B18/20
- IPC分类号： A61B18/20 ; A61M37/00
摘要：
A method of treating inaccessible microbial infections, the method comprising the steps of exposing the microbe, irradiating the microbe with infrared radiation and cooling such that heat inactivates the pathogen and stimulates a wound healing response in the patient.
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