发明申请
- 专利标题： STAMP, METHOD OF MANUFACTURING THE SAME, AND IMPRINTING METHOD USING THE STAMP
- 专利标题（中）： 印章，其制造方法和使用印章的印刷方法
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申请号： US13489968申请日： 2012-06-06
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公开(公告)号： US20130042779A1公开(公告)日： 2013-02-21
- 发明人: Woong Ko , Ki-yeon Yang , Byung-kyu Lee , Du-hyun Lee , Jae-kwan Kim
- 申请人： Woong Ko , Ki-yeon Yang , Byung-kyu Lee , Du-hyun Lee , Jae-kwan Kim
- 申请人地址： KR Suwon-si
- 专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人： SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址： KR Suwon-si
- 优先权： KR10-2011-0083055 20110819
- 主分类号： B41F19/00
- IPC分类号： B41F19/00 ; B29C33/38 ; B41N1/00
摘要：
A stamp includes at least one protrusion on a protrusion pattern, and an end portion of the at least one protrusion may have a non-planarized surface. The end portion of the protrusion may have a concave structure, that is, the end portion includes a center region and an edge region, and the edge region is higher than the center region.
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