发明申请
US20130049200A1 SILICIDATION OF DEVICE CONTACTS USING PRE-AMORPHIZATION IMPLANT OF SEMICONDUCTOR SUBSTRATE
审中-公开
使用半导体基板的预加工植入物进行器件接触的硅化
- 专利标题: SILICIDATION OF DEVICE CONTACTS USING PRE-AMORPHIZATION IMPLANT OF SEMICONDUCTOR SUBSTRATE
- 专利标题(中): 使用半导体基板的预加工植入物进行器件接触的硅化
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申请号: US13598686申请日: 2012-08-30
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公开(公告)号: US20130049200A1公开(公告)日: 2013-02-28
- 发明人: Paul R. Besser , Roy A. Carruthers , Christopher P. D'Emic , Christian Lavoie , Conal E. Murray , Kazuya Ohuchi , Christopher Scerbo , Bin Yang
- 申请人: Paul R. Besser , Roy A. Carruthers , Christopher P. D'Emic , Christian Lavoie , Conal E. Murray , Kazuya Ohuchi , Christopher Scerbo , Bin Yang
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 主分类号: H01L29/43
- IPC分类号: H01L29/43
摘要:
Silicidation techniques with improved rare earth silicide morphology for fabrication of semiconductor device contacts. For example, a method for forming silicide includes implanting a silicon layer with an amorphizing species to fond an amorphous silicon region in the silicon layer and depositing a rare earth metal film on the silicon layer in contact with the amorphous silicon region. A silicide process is then performed to combine the rare earth metal film and the amorphous silicon region to form a silicide film on the silicon layer.
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