发明申请
- 专利标题: Layer Alignment in FinFET Fabrication
- 专利标题(中): FinFET制造中的层对准
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申请号: US13217702申请日: 2011-08-25
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公开(公告)号: US20130052793A1公开(公告)日: 2013-02-28
- 发明人: Ming-Feng Shieh , Kuei-Liang Lu
- 申请人: Ming-Feng Shieh , Kuei-Liang Lu
- 申请人地址: TW Hsin-Chu
- 专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址: TW Hsin-Chu
- 主分类号: H01L21/30
- IPC分类号: H01L21/30
摘要:
Methods for aligning layers more accurately for FinFETs fabrication. An embodiment of the method, comprises: forming a plurality of dummy line features and a plurality of spacer elements according to a first pattern; removing portions of the plurality of spacer elements and portions of the plurality of dummy line features according to a second pattern; defining a reference area by removing some unwanted spacer elements according to a third pattern; aligning a front-end-of-line (FEOL) layer in X direction with the reference area defined by the third pattern; and aligning the FEOL layer in Y direction with the plurality of spacer elements defined by the first pattern. The reference area may be an active area or an alignment mask. The plurality of dummy line features and the plurality of spacer elements are formed on a substrate. The FEOL layer may be a poly layer or a shield layer.
公开/授权文献
- US09190261B2 Layer alignment in FinFET fabrication 公开/授权日:2015-11-17
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