Invention Application
- Patent Title: METHOD OF MANUFACTURING EUV MASK
- Patent Title (中): 制造EUV掩模的方法
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Application No.: US13592333Application Date: 2012-08-22
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Publication No.: US20130065163A1Publication Date: 2013-03-14
- Inventor: Toshihiko TANAKA
- Applicant: Toshihiko TANAKA
- Applicant Address: JP Kawasaki-shi
- Assignee: Renesas Electronics Corporation
- Current Assignee: Renesas Electronics Corporation
- Current Assignee Address: JP Kawasaki-shi
- Priority: JPJP2011-198197 20110912
- Main IPC: G03F1/22
- IPC: G03F1/22

Abstract:
Techniques for easily fabricating defect-free EUV masks with good yield are provided. A method of manufacturing an EUV mask according to the present invention includes the steps of: carrying out a defect inspection after depositing a multilayer film on a substrate; if a defect is found in the defect inspection, determining whether the defect is a recessed defect, a protruded defect, or defects in which the recessed defect and the protruded defect are mixed, and if the defects are the mixed defects of the recessed defect and the protruded defect, determining the relation in size between the defects; and depositing an additional multilayer film on the multilayer film while changing a film forming method in accordance with the results of the determination.
Public/Granted literature
- US08778571B2 Method of manufacturing EUV mask Public/Granted day:2014-07-15
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