发明申请
- 专利标题： CHIP PACKAGE STRUCTURE AND METHOD FOR MANUFACTURING THE SAME
- 专利标题（中）： 芯片包装结构及其制造方法
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申请号： US13232946申请日： 2011-09-14
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公开(公告)号： US20130065361A1公开(公告)日： 2013-03-14
- 发明人: Geng-Shin Shen
- 申请人： Geng-Shin Shen
- 申请人地址： TW Hsinchu
- 专利权人： CHIPMOS TECHNOLOGIES INC.
- 当前专利权人： CHIPMOS TECHNOLOGIES INC.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01L21/78
- IPC分类号： H01L21/78
摘要：
A method for manufacturing a semiconductor package structure is disclosed. In one embodiment, the method includes the steps of forming a plurality of conductive pastes on a matrix lead frame with a groove located within a predetermined distance from each conductive paste on the lead; partially curing the conductive pastes so that the conductive pastes are in a semi-cured state; preparing at least one chip with a plurality of bumps thereon; electrically connecting the chip and the lead by implanting the bumps into the semi-cured conductive pastes, wherein the groove on the lead of the matrix lead frame is configured to receive overflowed semi-cured conductive pastes; curing the semi-cured conductive pastes to completely secure the bumped chip; and forming an encapsulating material covering the lead frame and the chip. The method can also be applied in pre-molded lead frame package.
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