发明申请
US20130067424A1 LIFE PREDICTION METHOD OF ELECTRONIC DEVICE AND DESIGN METHOD OF ELECTRONIC DEVICE USING THE METHOD
审中-公开
电子设备的生命预测方法和使用该方法的电子设备的设计方法
- 专利标题： LIFE PREDICTION METHOD OF ELECTRONIC DEVICE AND DESIGN METHOD OF ELECTRONIC DEVICE USING THE METHOD
- 专利标题（中）： 电子设备的生命预测方法和使用该方法的电子设备的设计方法
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申请号： US13593499申请日： 2012-08-23
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公开(公告)号： US20130067424A1公开(公告)日： 2013-03-14
- 发明人: Kenichi YAMAMOTO , Ryosuke Kimoto , Kenya Kawano , Hisashi Tanie , Yasuhiro Naka
- 申请人： Kenichi YAMAMOTO , Ryosuke Kimoto , Kenya Kawano , Hisashi Tanie , Yasuhiro Naka
- 专利权人： RENESAS ELECTRONICS CORPORATION
- 当前专利权人： RENESAS ELECTRONICS CORPORATION
- 优先权： JP2011-196711 20110909
- 主分类号： G06F19/00
- IPC分类号： G06F19/00 ; G06F17/50
摘要：
A life prediction method of an electronic device in which the life prediction accuracy is more improved than that in a related art technique, and a design method of an electronic device based on the above method, are established. Life prediction is performed by incorporating either of a change in a physical property of a solder joint portion and a change in the fatigue life of a solder, the changes occurring when left at a high temperature. The change in a physical property of the solder joint portion or the change in the fatigue life of the solder is determined from the relationship between a heat treatment temperature and a heat treatment time. These changes are then formulated to be incorporated into the life prediction.
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