Invention Application
US20130069218A1 HIGH DENSITY PACKAGE INTERCONNECT WITH COPPER HEAT SPREADER AND METHOD OF MAKING THE SAME
审中-公开
高密度包装与铜热交换器的连接及其制造方法
- Patent Title: HIGH DENSITY PACKAGE INTERCONNECT WITH COPPER HEAT SPREADER AND METHOD OF MAKING THE SAME
- Patent Title (中): 高密度包装与铜热交换器的连接及其制造方法
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Application No.: US13237694Application Date: 2011-09-20
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Publication No.: US20130069218A1Publication Date: 2013-03-21
- Inventor: Lee Hua Alvin Seah
- Applicant: Lee Hua Alvin Seah
- Applicant Address: SG Singapore
- Assignee: STMicroelectronics Asia Pacific Pte Ltd.
- Current Assignee: STMicroelectronics Asia Pacific Pte Ltd.
- Current Assignee Address: SG Singapore
- Main IPC: H01L23/34
- IPC: H01L23/34 ; H01L21/56 ; H01L21/52
Abstract:
The integrated circuit packaging techniques of the disclosed embodiments utilize a thermally conductive heat sink to partially enclose an integrated circuit. The heat sink is separated from the integrated circuit by a substrate that is conformally positioned into a recess in the heat sink, enabling the heat sink to transfer thermal energy from the integrated circuit.
Information query
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