发明申请
- 专利标题： APPARATUS FOR STACKED ELECTRONIC CIRCUITRY AND ASSOCIATED METHODS
- 专利标题（中）： 堆叠式电子电路及相关方法的设备
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申请号： US13235166申请日： 2011-09-16
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公开(公告)号： US20130069247A1公开(公告)日： 2013-03-21
- 发明人: Arifur Rahman , Jon M. Long , Yuanlin Xie
- 申请人： Arifur Rahman , Jon M. Long , Yuanlin Xie
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/50
摘要：
An apparatus includes a substrate and a pair of die that include electronic circuitry. The substrate includes a cavity. One of the die is disposed in the cavity formed in the substrate. The other die is disposed above the first die and is electrically coupled to the first die.
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