发明申请
- 专利标题： DIE SUBSTRATE WITH REINFORCEMENT STRUCTURE
- 专利标题（中）： 具有加强结构的基片
-
申请号： US13671727申请日： 2012-11-08
-
公开(公告)号： US20130069250A1公开(公告)日： 2013-03-21
- 发明人: Roden Topacio , Adam Zbrzezny
- 申请人： Roden Topacio , Adam Zbrzezny
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; H01L21/50
摘要：
Various semiconductor chip package substrates with reinforcement and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes providing a package substrate that has a first side and a second side opposite to the first side. The first side has a central area adapted to receive a semiconductor chip. A solder reinforcement structure is formed on the first side of the package substrate outside of the central area to resist bending of the package substrate.
公开/授权文献
- US08927344B2 Die substrate with reinforcement structure 公开/授权日：2015-01-06
信息查询
IPC分类:
