发明申请
- 专利标题: Chip Comprising a Fill Structure
- 专利标题(中): 芯片包括填充结构
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申请号: US13247162申请日: 2011-09-28
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公开(公告)号: US20130075869A1公开(公告)日: 2013-03-28
- 发明人: Gunther Mackh , Gerhard Leschik , Adolf Koller , Harald Seidl
- 申请人: Gunther Mackh , Gerhard Leschik , Adolf Koller , Harald Seidl
- 申请人地址: DE Neubiberg
- 专利权人: Infineon Technologies AG
- 当前专利权人: Infineon Technologies AG
- 当前专利权人地址: DE Neubiberg
- 主分类号: H01L23/544
- IPC分类号: H01L23/544 ; G06F17/50 ; H01L21/78
摘要:
A chip includes a dielectric layer and a fill structure in the dielectric layer, wherein the fill structure extends along a dicing edge of the chip, with the fill structure abutting the dicing edge.
公开/授权文献
- US08704338B2 Chip comprising a fill structure 公开/授权日:2014-04-22