发明申请
- 专利标题: HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS OF THIN FILM
- 专利标题(中): 薄膜热处理方法及热处理装置
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申请号: US13609947申请日: 2012-09-11
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公开(公告)号: US20130078744A1公开(公告)日: 2013-03-28
- 发明人: Hiroki KIYAMA , Kazuhiko FUSE , Shinichi KATO
- 申请人: Hiroki KIYAMA , Kazuhiko FUSE , Shinichi KATO
- 优先权: JPJP2011-209365 20110926; JPJP2012-153169 20120709
- 主分类号: H01L21/30
- IPC分类号: H01L21/30 ; A21B1/22
摘要:
A semiconductor wafer, on the surface of which a silicon dioxide base material and an amorphous silicon thin film are formed in this order, is carried into a chamber. An insulated gate bipolar transistor (IGBT) is connected with a power supply circuit to a flash lamp, and the IGBT makes an energization period to the flash lamp to be 0.01 millisecond or more and 1 millisecond or less, consequently making a flash light irradiation time to be 0.01 millisecond or more and 1 millisecond or less. Since a flash heat treatment is performed with a remarkably short flash light irradiation time, the excessive heating of the thin film of amorphous silicon is suppressed and harmful influence such as the exfoliation of the film is prevented.
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