发明申请
US20130078744A1 HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS OF THIN FILM 有权
薄膜热处理方法及热处理装置

HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS OF THIN FILM
摘要:
A semiconductor wafer, on the surface of which a silicon dioxide base material and an amorphous silicon thin film are formed in this order, is carried into a chamber. An insulated gate bipolar transistor (IGBT) is connected with a power supply circuit to a flash lamp, and the IGBT makes an energization period to the flash lamp to be 0.01 millisecond or more and 1 millisecond or less, consequently making a flash light irradiation time to be 0.01 millisecond or more and 1 millisecond or less. Since a flash heat treatment is performed with a remarkably short flash light irradiation time, the excessive heating of the thin film of amorphous silicon is suppressed and harmful influence such as the exfoliation of the film is prevented.
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