发明申请
US20130078810A1 METHOD AND APPARATUS FOR PERFORMING A POLISHING PROCESS IN SEMICONDUCTOR FABRICATION
审中-公开
用于在半导体制造中执行抛光工艺的方法和装置
- 专利标题： METHOD AND APPARATUS FOR PERFORMING A POLISHING PROCESS IN SEMICONDUCTOR FABRICATION
- 专利标题（中）： 用于在半导体制造中执行抛光工艺的方法和装置
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申请号： US13240856申请日： 2011-09-22
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公开(公告)号： US20130078810A1公开(公告)日： 2013-03-28
- 发明人: Bo-I Lee , Huang Soon Kang , Chi-Ming Yang , Chin-Hsiang Lin
- 申请人： Bo-I Lee , Huang Soon Kang , Chi-Ming Yang , Chin-Hsiang Lin
- 申请人地址： TW Hsin-Chu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L21/302
- IPC分类号： H01L21/302 ; B24B53/00 ; B24B7/00
摘要：
The present disclosure provides an apparatus for fabricating a semiconductor device. The apparatus includes a polishing head that is operable to perform a polishing process to a wafer. The apparatus includes a retaining ring that is rotatably coupled to the polishing head. The retaining ring is operable to secure the wafer to be polished. The apparatus includes a soft material component located within the retaining ring. The soft material component is softer than silicon. The soft material component is operable to grind a bevel region of the wafer during the polishing process. The apparatus includes a spray nozzle that is rotatably coupled to the polishing head. The spray nozzle is operable to dispense a cleaning solution to the bevel region of the wafer during the polishing process.
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