Invention Application
- Patent Title: THERMOELECTRIC MODULE
- Patent Title (中): 热电模块
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Application No.: US13620925Application Date: 2012-09-15
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Publication No.: US20130081663A1Publication Date: 2013-04-04
- Inventor: Ju Hwan YANG , Kang Heon Hur , Sung Ho Lee , Dong Hyeok Choi
- Applicant: Ju Hwan YANG , Kang Heon Hur , Sung Ho Lee , Dong Hyeok Choi
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Priority: KR10-2011-0099222 20110929
- Main IPC: H01L35/32
- IPC: H01L35/32 ; F25B21/02
Abstract:
The present invention relates to a thermoelectric module, there is provided a thermoelectric module including a metal layer surface treated for securing roughness at one surface thereof and a top substrate and a bottom substrate made of an insulating film formed on the surface treated one surface.
Information query
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