Improved techniques are disclosed for housing electronic components. A first housing member can be made to have an exterior surface that covers a majority of the housing. The first housing member can be of unitary construction. The first housing member can be seamlessly constructed. The first housing member can be formed in one injection molding. An electrical power conduction pin can extend through an aperture in a cover plate, and can be arranged for mechanically coupling the cover plate with a major interior surface of the first housing member, so as to secure the cover plate to the first housing member.