发明申请
- 专利标题： ELECTRONIC PACKAGING CONNECTOR AND METHODS FOR ITS PRODUCTION
- 专利标题（中）： 电子包装连接器及其生产方法
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申请号： US13270268申请日： 2011-10-11
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公开(公告)号： US20130087371A1公开(公告)日： 2013-04-11
- 发明人: Georg Meyer-Berg
- 申请人： Georg Meyer-Berg
- 申请人地址： DE Neubiberg
- 专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人： INFINEON TECHNOLOGIES AG
- 当前专利权人地址： DE Neubiberg
- 主分类号： H05K1/09
- IPC分类号： H05K1/09 ; H01R9/00 ; H05K1/11
摘要：
A surface mount packaging connector includes an elastic conductor, an interconnect pad, and a conductive layer. The elastic conductor has a top surface. The interconnect pad is electrically coupled to the elastic conductor. The top surface of the elastic conductor is arranged away from the interconnect pad. The conductive layer is on the top surface of the elastic conductor. The conductive layer provides an increased electrically conductive surface area and may also be a solderable surface.
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