A socket structure of a micro switch includes a plurality conductive pins of at the bottom of the switch, and a plurality of grooves and distal slots, and the grooves are formed at the bottom of the switch, and the pins are disposed in the grooves, and the distal slots are formed on an outer wall of the switch and interconnected to the grooves respectively, and the top of the pin is extended into the distal slot, so that the pin is exposed from the outer wall of the switch, and the grooves are provided for positioning the pins and preventing them from being deformed, and containing a solder paste for soldering to prevent the switch from being protruded, and the distal slots are provided for extending a soldering iron to touch that pins to facilitate removing and soldering the switch on a surface of a circuit board.