发明申请
- 专利标题： Multi-Die LED Package
- 专利标题（中）： 多芯片LED封装
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申请号： US13441620申请日： 2012-04-06
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公开(公告)号： US20130092960A1公开(公告)日： 2013-04-18
- 发明人: Kurt S. Wilcox , Bernd Keller , Theodore Lowes , Peter S. Andrews
- 申请人： Kurt S. Wilcox , Bernd Keller , Theodore Lowes , Peter S. Andrews
- 申请人地址： US WI Racine
- 专利权人： RUUD LIGHTING, INC.
- 当前专利权人： RUUD LIGHTING, INC.
- 当前专利权人地址： US WI Racine
- 主分类号： H01L33/08
- IPC分类号： H01L33/08
摘要：
A light-emitting device comprising (a) a submount having front and back sides and including a ceramic layer; (b) an array of light-emitting diodes (LEDs) on the front side; and (c) a lens overmolded on the submount and covering the LED array. In some embodiments, the submount comprises at least two electrically-conductive contact pads on the front side, and each LED in the array is secured with respect to one of the contact pads.
公开/授权文献
- US09082921B2 Multi-die LED package 公开/授权日：2015-07-14
信息查询
IPC分类:
