Invention Application
US20130093072A1 LEADFRAME PAD DESIGN WITH ENHANCED ROBUSTNESS TO DIE CRACK FAILURE
审中-公开
LEADFRAME PAD设计与增强的鲁棒性，以破坏破裂
- Patent Title: LEADFRAME PAD DESIGN WITH ENHANCED ROBUSTNESS TO DIE CRACK FAILURE
- Patent Title (中): LEADFRAME PAD设计与增强的鲁棒性，以破坏破裂
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Application No.: US13273027Application Date: 2011-10-13
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Publication No.: US20130093072A1Publication Date: 2013-04-18
- Inventor: Xueren Zhang , Wingshenq Wong , Kim-Yong Goh , Yiyi Ma
- Applicant: Xueren Zhang , Wingshenq Wong , Kim-Yong Goh , Yiyi Ma
- Applicant Address: SG Singapore
- Assignee: STMICROELECTRONICS PTE LTD.
- Current Assignee: STMICROELECTRONICS PTE LTD.
- Current Assignee Address: SG Singapore
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/56
Abstract:
A leadframe includes a die pad and a protective wall surrounding the die pad. A semiconductor die is situated on the die pad. Indentations are formed on the four inner corners of the protective wall adjacent the corners of the semiconductor die.
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