发明申请
- 专利标题： SEMICONDUCTOR PACKAGE
- 专利标题（中）： 半导体封装
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申请号： US13277575申请日： 2011-10-20
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公开(公告)号： US20130099370A1公开(公告)日： 2013-04-25
- 发明人: Ming-Da CHENG , Chih-Wei LIN , Kuei-Wei HUANG , Yu-Peng TSAI , Chun-Cheng LIN , Chung-Shi LIU
- 申请人： Ming-Da CHENG , Chih-Wei LIN , Kuei-Wei HUANG , Yu-Peng TSAI , Chun-Cheng LIN , Chung-Shi LIU
- 申请人地址： TW Hsinchu
- 专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人： TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址： TW Hsinchu
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L21/60
摘要：
A semiconductor package includes a workpiece with a conductive trace and a chip with a conductive pillar. The chip is attached to the workpiece and a solder joint region is formed between the conductive pillar and the conductive trace. The distance between the conductive pillar and the conductive trace is less than or equal to about 16 μm.
公开/授权文献
- US09786622B2 Semiconductor package 公开/授权日：2017-10-10
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