发明申请
US20130101143A1 MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE CHIP WITH AN EXPANDED BACK CHAMBER
审中-公开
微电子机械系统麦克风芯片与扩展的后室
- 专利标题： MICRO-ELECTRO-MECHANICAL SYSTEM MICROPHONE CHIP WITH AN EXPANDED BACK CHAMBER
- 专利标题（中）： 微电子机械系统麦克风芯片与扩展的后室
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申请号： US13278558申请日： 2011-10-21
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公开(公告)号： US20130101143A1公开(公告)日： 2013-04-25
- 发明人: Hung-Jen CHEN , Kuan-Hsun Chiu , Chun-Chieh Wang , Ming-Li Hsu
- 申请人： Hung-Jen CHEN , Kuan-Hsun Chiu , Chun-Chieh Wang , Ming-Li Hsu
- 主分类号： H04R1/00
- IPC分类号： H04R1/00
摘要：
A MEMS microphone chip with an expanded chamber comprises a base plate, and the base plate has a main chamber and a secondary chamber. The secondary chamber is formed beside the main chamber, and is connected to the main chamber. A vibration membrane is suspended above the main chamber for receiving external sound waves, and the vibration membrane vibrates in corresponding to the chambers. The MEMS microphone chip has a higher sensitivity because of the expanded chamber, and therefore has a more ideal audio frequency response curve.
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