发明申请
- 专利标题: SEMICONDUCTOR MANUFACTURING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- 专利标题(中): 半导体制造装置及制造半导体器件的方法
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申请号: US13277609申请日: 2011-10-20
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公开(公告)号: US20130102152A1公开(公告)日: 2013-04-25
- 发明人: Yen-Chang CHAO , Kei-Wei CHEN , Ying-Lang WANG
- 申请人: Yen-Chang CHAO , Kei-Wei CHEN , Ying-Lang WANG
- 申请人地址: TW Hsinchu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsinchu
- 主分类号: H01L21/306
- IPC分类号: H01L21/306 ; B24B55/00 ; H01L21/304 ; B24B41/06
摘要:
A semiconductor manufacturing apparatus includes at least one inner retaining ring, and an outer retaining ring. The at least one inner retaining ring applies a first pressure to the polishing pad, and retains a substrate on the polishing pad. The outer retaining ring applies a second pressure to the polishing pad, and retains the at least one inner retaining ring on the polishing pad. Control of the first pressure is independent with respect to control of the second pressure.