发明申请
- 专利标题： METHOD AND COMPOSITION FOR CHEMICAL MECHANICAL PLANARIZATION OF A METAL OR A METAL ALLOY
- 专利标题（中）： 金属或金属合金的化学机械平面化方法与组成
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申请号： US13561398申请日： 2012-07-30
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公开(公告)号： US20130102153A1公开(公告)日： 2013-04-25
- 发明人: Xiaobo Shi , Bentley J. Palmer , Rebecca A. Sawayda
- 申请人： Xiaobo Shi , Bentley J. Palmer , Rebecca A. Sawayda
- 申请人地址： US PA Allentown
- 专利权人： AIR PRODUCTS AND CHEMICALS, INC.
- 当前专利权人： AIR PRODUCTS AND CHEMICALS, INC.
- 当前专利权人地址： US PA Allentown
- 主分类号： H01L21/306
- IPC分类号： H01L21/306
摘要：
A composition and associated method for chemical mechanical planarization of a metal-containing substrate (e.g., a copper substrate) are described herein which afford high and tunable rates of metal removal as well as low dishing and erosion levels during CMP processing.
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