Invention Application
- Patent Title: SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Patent Title (中): 半导体器件及其制造方法
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Application No.: US13497249Application Date: 2011-11-25
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Publication No.: US20130105763A1Publication Date: 2013-05-02
- Inventor: Huaxiang Yin , Jun Luo , Chao Zhao , Honggang Liu , Dapeng Chen
- Applicant: Huaxiang Yin , Jun Luo , Chao Zhao , Honggang Liu , Dapeng Chen
- Priority: CN201110339415.8 20111101
- International Application: PCT/CN2011/001965 WO 20111125
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L21/336 ; B82Y99/00

Abstract:
A semiconductor device, which comprises: a semiconductor substrate; a channel region on the semiconductor substrate, said channel region including a quantum well structure; a source region and a drain region on the sides of the channel region; a gate structure on the channel region; wherein the materials for the channel region, the source region and the drain region have different energy bands, and a tunneling barrier structure exists between the source region and the channel region.
Public/Granted literature
- US08816326B2 Semiconductor device and manufacturing method thereof Public/Granted day:2014-08-26
Information query
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