发明申请
US20130105979A1 Package on Package Devices and Methods of Packaging Semiconductor Dies 有权
封装器件封装和封装半导体芯片的方法

Package on Package Devices and Methods of Packaging Semiconductor Dies
摘要:
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal stud bumps are disposed between the first packaged die and the second packaged die. The metal stud bumps include a bump region and a tail region coupled to the bump region. The metal stud bumps are embedded in solder joints.
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