发明申请
- 专利标题: Package on Package Devices and Methods of Packaging Semiconductor Dies
- 专利标题(中): 封装器件封装和封装半导体芯片的方法
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申请号: US13483734申请日: 2012-05-30
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公开(公告)号: US20130105979A1公开(公告)日: 2013-05-02
- 发明人: Chen-Hua Yu , Chien-Hsun Lee , Chen Yung Ching
- 申请人: Chen-Hua Yu , Chien-Hsun Lee , Chen Yung Ching
- 申请人地址: TW Hsin-Chu
- 专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- 当前专利权人地址: TW Hsin-Chu
- 主分类号: H01L23/485
- IPC分类号: H01L23/485
摘要:
Package on package (PoP) devices and methods of packaging semiconductor dies are disclosed. A PoP device includes a first packaged die and a second packaged die coupled to the first packaged die. Metal stud bumps are disposed between the first packaged die and the second packaged die. The metal stud bumps include a bump region and a tail region coupled to the bump region. The metal stud bumps are embedded in solder joints.
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