发明申请
- 专利标题: CAMERA MODULE
- 专利标题(中): 相机模块
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申请号: US13549968申请日: 2012-07-16
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公开(公告)号: US20130107068A1公开(公告)日: 2013-05-02
- 发明人: Minsoo KIM , Seongcheol Jeong , Taemin Ha , Seonyoung Kim , Junghyun Lee
- 申请人: Minsoo KIM , Seongcheol Jeong , Taemin Ha , Seonyoung Kim , Junghyun Lee
- 优先权: KR10-2011-0111005 20111028; KR10-2011-0112294 20111031; KR10-2011-0112306 20111031; KR10-2011-0125616 20111129; KR10-2012-0013230 20120209
- 主分类号: H04N5/225
- IPC分类号: H04N5/225
摘要:
A camera module according to an embodiment of the present invention may include a first Printed Circuit Board (PCB) configured to have an image sensor mounted thereon; a housing unit disposed over the first PCB; a holder module spaced apart from a bottom surface within the housing unit at a specific interval and configured to have a first coil wound on its outer circumferential face and to include at least lens therein; a second PCB combined with the bottom surface of the holder module; a third PCB disposed over the holder module; and a plurality of wire springs each configured to have one end connected to the second PCB and the other end connected to the third PCB.
公开/授权文献
- US08817116B2 Camera module 公开/授权日:2014-08-26