A system for forming one or more layers of material on one or more substrates is described. The system includes a vacuum chamber and a showerhead located in the vacuum chamber. A door in a wall of the vacuum chamber allows for loading and unloading of the one or more substrates in the vacuum chamber while under vacuum. A drive mechanism coupled to the showerhead moves the showerhead between a first position and a second position while under vacuum. In the first position, the showerhead is positioned to allow access to the door for loading and unloading of the one or more substrates through the door. In the second position, the showerhead is positioned to inhibit access to the door inside the vacuum chamber.