发明申请
- 专利标题： ROOM TEMPERATURE BONDING APPARATUS AND ROOM TEMPERATURE BONDING METHOD
- 专利标题（中）： 室温结合装置和室温结合方法
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申请号： US13700929申请日： 2011-07-29
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公开(公告)号： US20130112334A1公开(公告)日： 2013-05-09
- 发明人: Takeshi Tsuno , Takayuki Goto , Masato Kinouchi , Kensuke Ide
- 申请人： Takeshi Tsuno , Takayuki Goto , Masato Kinouchi , Kensuke Ide
- 申请人地址： JP Tokyo
- 专利权人： MITSUBISHI HEAVY INDUSTRIES, LTD.
- 当前专利权人： MITSUBISHI HEAVY INDUSTRIES, LTD.
- 当前专利权人地址： JP Tokyo
- 优先权： JP2010-217441 20100928
- 国际申请： PCT/JP2011/067424 WO 20110729
- 主分类号： B32B37/00
- IPC分类号： B32B37/00
摘要：
A room temperature bonding method of the present invention includes a step of activating two substrates to prepare two activated substrates; a step of bonding the two activated substrates to produce a bonding resultant substrate; a step of performing annealing of the bonding resultant substrate to reduce residual stress of the bonding resultant substrate. According to such a room temperature bonding method, the residual stress of the bonding resultant substrate can be reduced and the quality can be improved.