- 专利标题： Mold Chase Design for Package-on-Package Applications
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申请号： US13298086申请日： 2011-11-16
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公开(公告)号： US20130119549A1公开(公告)日： 2013-05-16
- 发明人: Jung Wei Cheng , Chien-Hsiun Lee , Tsung-Ding Wang , Chun-Chih Chuang
- 申请人： Jung Wei Cheng , Chien-Hsiun Lee , Tsung-Ding Wang , Chun-Chih Chuang
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 主分类号： H01L23/48
- IPC分类号： H01L23/48 ; B29C39/10 ; H01L21/56
摘要：
A method includes placing a mold chase over a bottom package, wherein the bottom package has a connector at a top surface of the bottom package. The mold chase includes a cover, and a pin under and connected to the cover. The pin occupies a space extending from a top surface of the connector to the cover. A polymer is filled into a space between the cover of the mold chase and the bottom package. The polymer is then cured. After the step of curing the polymer, the mold chase is removed, and the connector is exposed through an opening in the polymer, wherein the opening is left by the pin of the mold chase.
公开/授权文献
- US08658464B2 Mold chase design for package-on-package applications 公开/授权日：2014-02-25
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