发明申请
- 专利标题: MANUFACTURING METHOD AND COVER FOR ELECTROINC DEVICE
- 专利标题(中): 电子器件制造方法和封装
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申请号: US13332591申请日: 2011-12-21
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公开(公告)号: US20130126203A1公开(公告)日: 2013-05-23
- 发明人: NAI-LIN YANG , BING ZHANG , SHI-FENG WANG
- 申请人: NAI-LIN YANG , BING ZHANG , SHI-FENG WANG
- 申请人地址: HK Kowloon CN ShenZhen City
- 专利权人: FIH (HONG KONG) LIMITED,SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
- 当前专利权人: FIH (HONG KONG) LIMITED,SHENZHEN FUTAIHONG PRECISION INDUSTRY CO., LTD.
- 当前专利权人地址: HK Kowloon CN ShenZhen City
- 优先权: CN201120469529.X 20111123
- 主分类号: H05K5/00
- IPC分类号: H05K5/00 ; H05K13/00 ; B29C45/16
摘要:
A cover for an electronic device includes a display window and a cover body injection molded with the display window. The display window includes a window body and at least one protruding portion projecting form the window body. The cover body includes a cover wall and ribs. The window body includes a front surface, a rear surface and a peripheral surface connecting the front surface and the rear surface. The at least one protruding portion is fixed on the peripheral surface and embedded between the cover wall and the ribs.
公开/授权文献
- US08581100B2 Manufacturing method and cover for electronic device 公开/授权日:2013-11-12
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