Invention Application
US20130127509A1 EMI SHIELDING CIRCUIT AND SEMICONDUCTOR INTEGRATED CIRCUIT INCLUDING THE SAME 有权
EMI屏蔽电路和包括其的半导体集成电路

  • Patent Title: EMI SHIELDING CIRCUIT AND SEMICONDUCTOR INTEGRATED CIRCUIT INCLUDING THE SAME
  • Patent Title (中): EMI屏蔽电路和包括其的半导体集成电路
  • Application No.: US13340885
    Application Date: 2011-12-30
  • Publication No.: US20130127509A1
    Publication Date: 2013-05-23
  • Inventor: Jun Ho LEE
  • Applicant: Jun Ho LEE
  • Applicant Address: KR Icheon-si
  • Assignee: HYNIX SEMICONDUCTOR INC.
  • Current Assignee: HYNIX SEMICONDUCTOR INC.
  • Current Assignee Address: KR Icheon-si
  • Priority: KR10-2011-0121702 20111121
  • Main IPC: H03K3/00
  • IPC: H03K3/00
EMI SHIELDING CIRCUIT AND SEMICONDUCTOR INTEGRATED CIRCUIT INCLUDING THE SAME
Abstract:
An electromagnetic interference (EMI) shielding circuit and a semiconductor integrated circuit including the same are provided. The EMI shielding circuit includes a data level comparison unit, a control signal generation unit, and a driver for EMI cancellation. The data level comparison unit generates a data comparison signal by comparing a number of high-level data transmitted through a plurality of data lines and a number of low-level data transmitted through the plurality of data lines. The control signal generation unit generates a driving control signal in response to the data comparison signal. The driver for EMI cancellation outputs an EMI cancellation signal in response to the driving control signal.
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