发明申请
- 专利标题: SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME
- 专利标题(中): 半导体器件及其制造方法
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申请号: US13611759申请日: 2012-09-12
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公开(公告)号: US20130134520A1公开(公告)日: 2013-05-30
- 发明人: Shigenobu Maeda , Hyun-pil Noh , Choong-ho Lee , Seog-heon Ham
- 申请人: Shigenobu Maeda , Hyun-pil Noh , Choong-ho Lee , Seog-heon Ham
- 申请人地址: KR Suwon-si
- 专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人: SAMSUNG ELECTRONICS CO., LTD.
- 当前专利权人地址: KR Suwon-si
- 优先权: KR10-2011-0124393 20111125
- 主分类号: H01L27/088
- IPC分类号: H01L27/088
摘要:
Provided are a semiconductor device including a high voltage transistor and a low voltage transistor and a method of manufacturing the same. The semiconductor device includes a semiconductor substrate including a high voltage region and a low voltage region; a high voltage transistor formed in the high voltage region and including a first active region, a first source/drain region, a first gate insulating layer, and a first gate electrode; and a low voltage transistor formed in the low voltage region and including a second active region, a second source/drain region, a second gate insulating layer, and a second gate electrode. The second source/drain region has a smaller thickness than a thickness of the first source/drain region.
公开/授权文献
- US08809990B2 Semiconductor device and method of manufacturing the same 公开/授权日:2014-08-19
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