发明申请
- 专利标题: SILICON SUBSTRATE, METHOD OF MANUFACTURING THE SAME, AND INKJET PRINT HEAD
- 专利标题(中): 硅基板,其制造方法和喷墨打印头
-
申请号: US13572018申请日: 2012-08-10
-
公开(公告)号: US20130135395A1公开(公告)日: 2013-05-30
- 发明人: Jae Chang LEE , Tae Kyung Lee , Hwa Sun Lee , Sung Wook Kim
- 申请人: Jae Chang LEE , Tae Kyung Lee , Hwa Sun Lee , Sung Wook Kim
- 申请人地址: KR Suwon
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Suwon
- 优先权: KR10-2011-0126591 20111130
- 主分类号: B41J2/04
- IPC分类号: B41J2/04 ; H01L21/306
摘要:
There is provided a silicon substrate including: a first connection part connected to a manifold and having a first width of a first size; a second connection part connected to a pressure chamber and having a second width of a second size; and a restrictor part connecting the first connection part to the second connection part and having a third width of a third size smaller than the first size or the second size, wherein a boundary part connecting the restrictor part to the first connection part or the restrictor part to the second connection part is formed to be curved.
信息查询
IPC分类: