发明申请
- 专利标题: METHOD OF MANUFACTURING THERMAL HEAD, AND THERMAL PRINTER
- 专利标题(中): 制造热头和热打印机的方法
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申请号: US13680914申请日: 2012-11-19
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公开(公告)号: US20130141507A1公开(公告)日: 2013-06-06
- 发明人: Keitaro KOROISHI , Norimitsu SANBONGI , Noriyoshi SHOJI , Toshimitsu MOROOKA
- 申请人: Seiko Instruments Inc.
- 申请人地址: JP Chiba-shi
- 专利权人: SEIKO INSTRUMENTS INC.
- 当前专利权人: SEIKO INSTRUMENTS INC.
- 当前专利权人地址: JP Chiba-shi
- 优先权: JP2011-263967 20111201
- 主分类号: H01C17/00
- IPC分类号: H01C17/00 ; B41J2/335
摘要:
A method of manufacturing a thermal head, comprising the steps of: bonding a support substrate and an upper substrate, which have a flat shape, together in a laminated state, the support substrate and the upper substrate having opposed surfaces, at least one of which includes a concave portion; thinning the upper substrate bonded onto the support substrate; a measurement step of measuring a thickness of the thinned upper substrate; determining a target resistance value of a heating resistor from the following expression based on the measured thickness of the upper substrate; and forming the heating resistor having the target resistance value at a position opposed to the concave portion, Rh=R0×(1+(D1+D0)/(D0+K)) where Rh represents the target resistance value; R0, a design resistance value; D1, the thickness of the upper substrate; D0, a design thickness of the upper substrate; and K, a heating efficiency coefficient.
公开/授权文献
- US08749602B2 Method of manufacturing thermal head, and thermal printer 公开/授权日:2014-06-10