发明申请
US20130146872A1 Semiconductor Device and Method of Forming Conductive Pillars Having Recesses or Protrusions to Detect Interconnect Continuity Between Semiconductor Die and Substrate
有权
半导体器件和形成导电支柱的方法,其具有凹陷或突起以检测半导体管芯和衬底之间的互连连续性
- 专利标题: Semiconductor Device and Method of Forming Conductive Pillars Having Recesses or Protrusions to Detect Interconnect Continuity Between Semiconductor Die and Substrate
- 专利标题(中): 半导体器件和形成导电支柱的方法,其具有凹陷或突起以检测半导体管芯和衬底之间的互连连续性
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申请号: US13324349申请日: 2011-12-13
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公开(公告)号: US20130146872A1公开(公告)日: 2013-06-13
- 发明人: Jen Yu Chen , Ting Yu Fu , Men Hsien Li , Chien Chen Lee
- 申请人: Jen Yu Chen , Ting Yu Fu , Men Hsien Li , Chien Chen Lee
- 申请人地址: SG Singapore
- 专利权人: STATS ChipPAC, LTD.
- 当前专利权人: STATS ChipPAC, LTD.
- 当前专利权人地址: SG Singapore
- 主分类号: H01L23/48
- IPC分类号: H01L23/48 ; H01L21/66
摘要:
A semiconductor device has a semiconductor die and conductive pillar with a recess or protrusion formed over a surface of the semiconductor die. The conductive pillar is made by forming a patterning layer over the semiconductor die, forming an opening with a recess or protrusion in the patterning layer, depositing conductive material in the opening and recess or protrusion, and removing the patterning layer. A substrate has bump material deposited over a conductive layer formed over a surface of the substrate. The bump material is melted. The semiconductor die is pressed toward the substrate to enable the melted bump material to flow into the recess or over the protrusion if the conductive pillar makes connection to the conductive layer. A presence or absence of the bump material in the recess or protrusion of the conductive pillar is detected by X-ray or visual inspection.