- 专利标题: ON-CHIP CAPACITORS IN COMBINATION WITH CMOS DEVICES ON EXTREMELY THIN SEMICONDUCTOR ON INSULATOR (ETSOI) SUBSTRATES
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申请号: US13314238申请日: 2011-12-08
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公开(公告)号: US20130146952A1公开(公告)日: 2013-06-13
- 发明人: THOMAS N. ADAM , Kangguo Cheng , Ali Khakifirooz , Alexander Reznicek
- 申请人: THOMAS N. ADAM , Kangguo Cheng , Ali Khakifirooz , Alexander Reznicek
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L21/336 ; H01L21/02
摘要:
A device including a semiconductor on insulator (SOI) substrate including a semiconductor device region and a capacitor device region. A semiconductor device present in the semiconductor device region. The semiconductor device including a gate structure present on a semiconductor on insulator (SOI) layer of the SOI substrate, extension source and drain regions present in the SOI layer on opposing sides of the gate structure, and raised source and drain regions composed of a first portion of an epitaxial semiconductor material on the SOI layer. A capacitor is present in the capacitor device region, said capacitor including a first electrode comprised of a second portion of the epitaxial semiconductor material that has a same composition and crystal structure as the first portion of the epitaxial semiconductor material, a node dielectric layer present on the second portion of the epitaxial semiconductor material, and a second electrode comprised of a conductive material.
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