发明申请
- 专利标题: PRINTED CIRCUIT BOARD WITH EMI REMOVAL
- 专利标题(中): 印刷电路板与EMI去除
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申请号: US13572764申请日: 2012-08-13
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公开(公告)号: US20130148319A1公开(公告)日: 2013-06-13
- 发明人: LEI LI
- 申请人: LEI LI
- 申请人地址: TW Tu-Cheng CN Shenzhen City
- 专利权人: HON HAI PRECISION INDUSTRY CO., LTD.,HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
- 当前专利权人: HON HAI PRECISION INDUSTRY CO., LTD.,HONG FU JIN PRECISION INDUSTRY (ShenZhen) CO., LTD.
- 当前专利权人地址: TW Tu-Cheng CN Shenzhen City
- 优先权: CN201110408567.9 20111209
- 主分类号: H05K1/11
- IPC分类号: H05K1/11 ; H05K5/00
摘要:
An exemplary printed circuit board includes a main body and a fixing component. The main body includes a first signal layer, a grounding layer, a power layer, and a second signal layer, arranged in that order. A through hole is defined on the main body, and includes a latching hole and a connecting hole. The latching hole is defined by and extends through the first signal layer. The connecting hole is defined by and extends from the second signal layer to the grounding layer, and communicates with the latching hole. The fixing component passes through the through hole, and thereby forms a direct connection with a grounding point of an electronic device.
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