Invention Application
- Patent Title: INTEGRATED CIRCUIT PACKAGING SYSTEM WITH LEADS AND METHOD OF MANUFACTURE THEREOF
- Patent Title (中): 具有引线的集成电路封装系统及其制造方法
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Application No.: US13326090Application Date: 2011-12-14
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Publication No.: US20130154080A1Publication Date: 2013-06-20
- Inventor: Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
- Applicant: Byung Tai Do , Arnel Senosa Trasporto , Linda Pei Ee Chua
- Main IPC: H01L23/36
- IPC: H01L23/36 ; H01L21/56 ; H01L21/60
Abstract:
A method of manufacture of an integrated circuit packaging system includes: forming a lead; forming an interior conductive layer having an interior top side and an interior bottom side, the interior bottom side directly on the lead; mounting an integrated circuit over the lead, the integrated circuit having an inactive side and an active side; forming an encapsulation directly on the inactive side and the interior top side; and forming an insulation layer directly on the active side and a portion of the interior bottom side.
Public/Granted literature
- US08525325B2 Integrated circuit packaging system with leads and method of manufacture thereof Public/Granted day:2013-09-03
Information query
IPC分类:
