发明申请
- 专利标题: PLANARIZING METHOD
- 专利标题(中): 平面化方法
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申请号: US13603924申请日: 2012-09-05
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公开(公告)号: US20130157464A1公开(公告)日: 2013-06-20
- 发明人: Akifumi GAWASE , Yukiteru Matsui
- 申请人: Akifumi GAWASE , Yukiteru Matsui
- 优先权: JP2011-278837 20111220
- 主分类号: H01L21/306
- IPC分类号: H01L21/306 ; B44C1/22
摘要:
According to one embodiment, a planarizing method is proposed. In the planarizing method, a surface to be processed of an object to be processed including a silicon oxide film is planarized in a processing solution by bringing the surface to be processed into contact with or close proximity with the surface of a solid-state plate on which fluorine is adsorbed. The bonding energy between fluorine and the solid-state plate is lower than that between fluorine and silicon.
公开/授权文献
- US08936729B2 Planarizing method 公开/授权日:2015-01-20