发明申请
- 专利标题： FULL WAFER PROCESSING BY MULTIPLE PASSES THROUGH A COMBINATORIAL REACTOR
- 专利标题（中）： 通过多个通过组合反应器进行全面加工
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申请号： US13337425申请日： 2011-12-27
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公开(公告)号： US20130164906A1公开(公告)日： 2013-06-27
- 发明人: Rajesh Kelekar , Aaron Francis , Gregory Lim
- 申请人： Rajesh Kelekar , Aaron Francis , Gregory Lim
- 申请人地址： US CA San Jose
- 专利权人： Intermolecular, Inc.
- 当前专利权人： Intermolecular, Inc.
- 当前专利权人地址： US CA San Jose
- 主分类号： H01L21/76
- IPC分类号： H01L21/76
摘要：
Overlapping combinatorial processing can offer more processed regions, better particle performance and simpler process equipment. In overlapping combinatorial processing, one or more regions are processed in series with some degrees of overlapping between regions. In some embodiments, overlapping combinatorial processing can be used in conjunction with non-overlapping combinatorial processing and non-combinatorial processing to develop and investigate materials and processes for device processing and manufacturing.
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