发明申请
US20130168068A1 THERMALLY ENHANCED COLD PLATE HAVING HIGH CONDUCTIVITY THERMAL TRANSFER PATHS
审中-公开
具有高电导率热转移温度的热增强冷板
- 专利标题: THERMALLY ENHANCED COLD PLATE HAVING HIGH CONDUCTIVITY THERMAL TRANSFER PATHS
- 专利标题(中): 具有高电导率热转移温度的热增强冷板
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申请号: US13339514申请日: 2011-12-29
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公开(公告)号: US20130168068A1公开(公告)日: 2013-07-04
- 发明人: Zhen Huang , Vinod Kamath , Howard V. Mahaney, JR. , Chunjian Ni , Mark E. Steinke , Jamil A. Wakil
- 申请人: Zhen Huang , Vinod Kamath , Howard V. Mahaney, JR. , Chunjian Ni , Mark E. Steinke , Jamil A. Wakil
- 申请人地址: US NY Armonk
- 专利权人: International Business Machines Corporation
- 当前专利权人: International Business Machines Corporation
- 当前专利权人地址: US NY Armonk
- 主分类号: F28F3/12
- IPC分类号: F28F3/12
摘要:
A cold plate comprises a cold plate body having a base for thermally engaging a heat-generating device, a plurality of internal channels extending through the cold plate body for the passage of a liquid coolant, a first region between the base and the plurality of internal channels, and a second region between the plurality of internal channels and a top that is generally opposite the base from the plurality of internal channels. The cold plate body is made from a first thermally conductive material. The cold plate also comprises at least one thermally conductive member extending around the plurality of channels from the first region below the plurality of channels to the second region above the plurality of channels. The at least one thermally conductive member has a greater thermal conductivity than the first thermally conductive material to move heat from the first region to the second region.