发明申请
US20130170149A1 CONNECTOR AND ELECTRONIC CIRCUIT ASSEMBLY FOR IMPROVED WET INSULATION RESISTANCE
有权
连接器和电子电路组件，用于改善耐湿绝缘性
- 专利标题： CONNECTOR AND ELECTRONIC CIRCUIT ASSEMBLY FOR IMPROVED WET INSULATION RESISTANCE
- 专利标题（中）： 连接器和电子电路组件，用于改善耐湿绝缘性
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申请号： US13821833申请日： 2011-09-29
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公开(公告)号： US20130170149A1公开(公告)日： 2013-07-04
- 发明人: Jason A. Reese , Samar R. Teli , James R. Keenihan , Joseph A. Langmaid , Kevin D. Maak , Michael E. Mills , Timothy C. Plum , Narayan Ramesh
- 申请人： Jason A. Reese , Samar R. Teli , James R. Keenihan , Joseph A. Langmaid , Kevin D. Maak , Michael E. Mills , Timothy C. Plum , Narayan Ramesh
- 申请人地址： US MI Midland
- 专利权人： Dow Global Technologies LLC
- 当前专利权人： Dow Global Technologies LLC
- 当前专利权人地址： US MI Midland
- 国际申请： PCT/US2011/053879 WO 20110929
- 主分类号： H05K7/00
- IPC分类号： H05K7/00
摘要：
The present invention is premised upon a connector and electronic circuit assembly (130) at least partially encased in a polymeric frame (200). The assembly including at least: a connector housing (230); at least one electrical connector (330); at least one electronic circuit component (430); and at least one barrier element (530).
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