发明申请
US20130174577A1 Heating and Cooling Unit with Semiconductor Device and Heat Pipe
审中-公开
具有半导体器件和热管的加热和冷却单元
- 专利标题: Heating and Cooling Unit with Semiconductor Device and Heat Pipe
- 专利标题(中): 具有半导体器件和热管的加热和冷却单元
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申请号: US13347229申请日: 2012-01-10
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公开(公告)号: US20130174577A1公开(公告)日: 2013-07-11
- 发明人: Francis Thomas Brija , Ping Wu
- 申请人: Francis Thomas Brija , Ping Wu
- 申请人地址: US IL Naperville
- 专利权人: Spring (U.S.A.) Corporation
- 当前专利权人: Spring (U.S.A.) Corporation
- 当前专利权人地址: US IL Naperville
- 主分类号: F25B21/02
- IPC分类号: F25B21/02
摘要:
Aspects of the invention support the changing of a serving surface temperature in order to cool or heat the serving surface. Heat is transferred to or from the serving surface through at least one Peltier device, a heat pipe, and a heat sink. The mode of operation is determined by changing the electrical power polarity to the at least one Peltier device. A control device may activate the at least one Peltier device from a measured temperature and a temperature setting with a hysteresis. A plurality of Peltier devices may be partitioned into different subsets so that the control device may activate a selected subset during different time intervals. When the measured temperature is outside a temperature range, all of the Peltier devices may be activated, while only a selected subset may be activated when the measured temperature is within the temperature range and until a hysteresis temperature is reached.
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